Technical Specifications

AirBorn Flexible Circuits Inc. is a full service organization providing services from concept design through to manufacturing and inspection.  See the list below to review some of the key capabilities and specifications we offer.




Design Software Compatibility

  Standard Advanced  Development
Mentor Graphics PADS X

DXF X

ASCII X

 
Cadence Alelgro
X  
AutoCAD
X  
Pro/ENGINEER (Pro/E)
X  
IGES

 X 
STEP

X
Full Design Services

X
Design Verification

X

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Manufacturing Software Compatibility


Standard Advanced  Development
CAM 350 X
Gerber 274-X X
HPGL ½  X  
ODB++ X  
eCAM
X

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Product Type

  Standard Advanced  Development
Single Sided Flex (Type I) 1 Layer N/A
N/A
Double Sided Flex (Type 2) 2 Layers N/A
N/A
Multilayer Flex (Type 3) 3 - 6 Layers 7 - 10 Layers >= 11 Layers
Rigid Flex 3 - 6 Layers 7 - 12 Layers >= 13 Layers
Sculpture Flex 1 - 2 Layers N/A N/A
High Density Edge Connection Flex (HDEC) 1 Layer N/A N/A
Extended Length Flex 1 Layer (up to 80ft) 2 Layers (up to 60in) >= 3 Layers (up to 34in) 

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Panel Dimensions

  Standard Advanced  Development
6 X 24
8 X 24
12 X 18
18 X 24
20 X 24
>24 in Length

Minimum Thickness 0.5 oz 0.25 oz <0.25 oz

Profile Tolerances 0.005" - 0.010" 0.002" - 0.004" <0.002"

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Conductor Minimums

  Standard Advanced  Development
Trace Width (Copper Weight Dependent) 4 mil 3 mil < 3 mil
Space Width (Copper Weight Dependent) 4 mil 3 mil < 3 mil

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Hole & Pad Size Minimums

  Standard Advanced  Development
Hole Size 0.008" 0.006" < 0.006"
Pad to Finished Drill Ratio (Surface Finish Dependent) 2.5x the hole size 3x the hole size
Aspect Ratio 8:1 12:1 >12:1
Blidn and Buried Vias (Rigid Flex) N/A N/A Yes
Via Fill N/A N/A Yes

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Impedance Control

  Standard Advanced  Development
Differential +/- 10% +/- 7% <=6%
Single Ended +/- 10% +/- 7% <=6%

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Materials

  Standard
Dialetrics Polyimide FR
Polyimide LF
Polyimide AP
Polyimide TK
LCP

Copper Rolled Annealed
Electro Deposited
Berilium Alloy

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Plating

  Standard
Panel Plating Yes
Selective (Button) Plating Yes
Electroless Copper Yes

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Surface Finishes

  Standard
Soldermask Yes
Photo Imagible Coverlay Yes
Hot Air Solder Leveling (HASL) Yes
Tin / Lead Yes
Bright Tin Yes
Immersion Tin Yes
Electroless Nickel Immersion Gold (ENIG) Yes
Electrolytic (Hard) Gold Yes

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Shielding

  Standard
Solid Copper Yes
Cross Hatch Pattern - Copper Yes
Silver Ink Epoxy Yes

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Assembly Capabilities

  Standard
SMT (Machine Soldering) Yes
Hand Soldering Yes
Wave Soldering Yes
Crimping Yes
BGA Yes
Eccobonding Yes
Conformal Coating Yes
Full Supply Chain Management (Turn Key) Yes
RoHS Capable Yes

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Testing Capabilities

  Standard
Grid Testing (Panels) Yes
Flying Probe (Panels) Yes
Impedance Testing Yes
Continuity Testing Yes
Functional Testing Yes
Surface Ionic (Cleanliness) Testing Yes
IST - Flex Cycling Yes
Environmental Testing Yes

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Inspection Capabilities

  Standard
Microsection (IPC/MIL standards) Yes
Automated Optical Inspection (Inner & Outer Layers) Yes
Automated Optical Inspection (Assembled Components) Yes
First Article Inspection (including AS9100 FAI) Yes
Laser CMM (Coordinate Measuring Machine) Yes

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Certifications and Standards

  Standard
ISO 9001-2008
Yes
IPC 6013 Class 3
Yes
IPC 600 Class 3
Yes
IPC 610 Class 3
Yes
IPC J-STD-001
Yes
UL 94 V0 / V1
Yes
Mil-PRF-31032/3&/4
Yes
Mil-P-50884E
Yes
AS9100C
Yes

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