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Z-Axis Interposer Compression Connectors

The Z Series family of high-density, board-to-board or flex circuit stacking applications offers users a reliable one-piece contact system.  Its solderless interconnect is compressed under pressure between parallel, printed wiring boards or between a printed wiring board and other electronic components.  Designed for board-to-board applications where board spacing is between 0.100" and 0.350", Z Series uses a patented z-axis contact system that is specifically engineered to meet AirBorn's strict performance and reliability requirements.

  • 0.050" (1.27mm) contact spacing
  • 2, 3, 4 5, 6 & 7 row options
  • 20-175 contacts
  • Z-axis compression
  • Solderless
  • SMT Termination
  • Assembled in the USA
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