Technical Specifications

AirBorn Flexible Circuits Inc. is a full service organization providing services from concept design through to manufacturing and inspection. See the list below to review some of the key capabilities and specifications we offer.

AirBorn_Flexible_Circuit_Logo_4C_WEB-flex-flexible-circuit-assembly-assemblies

Assembly Capabilities
Certifications and Standards
Conductor Minimums
Design Software Compatibility
Hole & Pad Size Minimums
Impedance Control
Inspection Capabilities
Manufacturing Software Compatibility

Materials
Panel Dimensions
Plating
Product Type
Shielding
Surface Finishes
Testing Capabilities

Design Software Compatibility

	Standard	Advanced	Development
Mentor Graphics PADS	X
DXF	X
ASCII	X
Cadence Alelgro		X
AutoCAD		X
Pro/ENGINEER (Pro/E)		X
IGES			X
STEP			X
Full Design Services			X
Design Verification			X

Manufacturing Software Compatibility

	Standard	Advanced	Development
CAM 350	X
Gerber 274-X	X
HPGL ½		X
ODB++		X
eCAM			X

Product Type

	Standard	Advanced	Development
Single Sided Flex (Type I)	1 Layer	N/A	N/A
Double Sided Flex (Type 2)	2 Layers	N/A	N/A
Multilayer Flex (Type 3)	3 - 6 Layers	7 - 10 Layers	>= 11 Layers
Rigid Flex	3 - 6 Layers	7 - 12 Layers	>= 13 Layers
Sculpture Flex	1 - 2 Layers	N/A	N/A
High Density Edge Connection Flex (HDEC)	1 Layer	N/A	N/A
Extended Length Flex	1 Layer (up to 80ft)	2 Layers (up to 60in)	>= 3 Layers (up to 34in)

Panel Dimensions

	Standard	Advanced	Development
	6 X 24
	8 X 24
	12 X 18
	18 X 24
	20 X 24
		>24 in Length

Minimum Thickness	0.5 oz	0.25 oz	<0.25 oz

Profile Tolerances	0.005" - 0.010"	0.002" - 0.004"	<0.002"

Conductor Minimums

	Standard	Advanced	Development
Trace Width (Copper Weight Dependent)	4 mil	3 mil	< 3 mil
Space Width (Copper Weight Dependent)	4 mil	3 mil	< 3 mil

Hole & Pad Size Minimums

	Standard	Advanced	Development
Hole Size	0.008"	0.006"	< 0.006"
Pad to Finished Drill Ratio (Surface Finish Dependent)	2.5x the hole size	3x the hole size
Aspect Ratio	8:1	12:1	>12:1
Blidn and Buried Vias (Rigid Flex)	N/A	N/A	Yes
Via Fill	N/A	N/A	Yes

Impedance Control

	Standard	Advanced	Development
Differential	+/- 10%	+/- 7%	<=6%
Single Ended	+/- 10%	+/- 7%	<=6%

Materials

	Standard
Dialetrics	Polyimide FR
	Polyimide LF
	Polyimide AP
	Polyimide TK
	LCP

Copper	Rolled Annealed
	Electro Deposited
	Berilium Alloy

Plating

	Standard
Panel Plating	Yes
Selective (Button) Plating	Yes
Electroless Copper	Yes

Surface Finishes

	Standard
Soldermask	Yes
Photo Imagible Coverlay	Yes
Hot Air Solder Leveling (HASL)	Yes
Tin / Lead	Yes
Bright Tin	Yes
Immersion Tin	Yes
Electroless Nickel Immersion Gold (ENIG)	Yes
Electrolytic (Hard) Gold	Yes

Shielding

	Standard
Solid Copper	Yes
Cross Hatch Pattern - Copper	Yes
Silver Ink Epoxy	Yes

Assembly Capabilities

	Standard
SMT (Machine Soldering)	Yes
Hand Soldering	Yes
Wave Soldering	Yes
Crimping	Yes
BGA	Yes
Eccobonding	Yes
Conformal Coating	Yes
Full Supply Chain Management (Turn Key)	Yes
RoHS Capable	Yes

Testing Capabilities

	Standard
Grid Testing (Panels)	Yes
Flying Probe (Panels)	Yes
Impedance Testing	Yes
Continuity Testing	Yes
Functional Testing	Yes
Surface Ionic (Cleanliness) Testing	Yes
IST - Flex Cycling	Yes
Environmental Testing	Yes

Inspection Capabilities

	Standard
Microsection (IPC/MIL standards)	Yes
Automated Optical Inspection (Inner & Outer Layers)	Yes
Automated Optical Inspection (Assembled Components)	Yes
First Article Inspection (including AS9100 FAI)	Yes
Laser CMM (Coordinate Measuring Machine)	Yes

Certifications and Standards

	Standard
ISO 9001-2008	Yes
IPC 6013 Class 3	Yes
IPC 600 Class 3	Yes
IPC 610 Class 3	Yes
IPC J-STD-001	Yes
UL 94 V0 / V1	Yes
Mil-PRF-31032/3&/4	Yes
Mil-P-50884E	Yes
AS9100C	Yes