Product Catalogs & Brochures

As more composite and industry-specific catalogs are compiled, we will be adding them to this space. 

AirBorn's NEW, ultra-miniature circular connectors offer OEMs a lightweight, watertight and easy-to-clean circular connector option.

Series 360 Catalog >>

The W-Series products are internationally accepted and approved to MIL-55302 standard. The W-Series is the benchmark against which so many others are measured.

The R-Series products are a high-density MIL-55302-approved connector. These connectors are the standard for high-density board-to-board interconnects.

The M-Series products are approved to MIL-83513 standard. This product offers an extensive mix of termination styles and custom design capability.

Nano products are approved to MIL-32139 standard. The N-Series offers ultimate connector solution for the smallest and most demanding spaces.

The AirBorn verSI (versatile connectors with high-speed signal integrity) open-pin field product line is designed to meet the requirements for high-speed/high-density/signal integrity 100 Ω and 85 Ω differential serial bus applications while still delivering the reliability customers have come to expect from AirBorn.

Airborn offers a full range of integrated flexible circuit services comprising design, DFm, DFt, prototypes, production manufacturing, hand and automated assembly, and testing.

A Micro-D, multi-gigabit high-speed connector, designed to meet the performance requirements of MIL-DTL-83513, where applicable. This rugged connector system is designed to handle LVDS serial bus signals like IEEE 1394, Ethernet, serial rapid IO, etc.  It has a range from one to ten high-speed modules and up to fifty signal contacts making it ideal for most high-reliability applications.

MicroSI delivers flexibility by design, offering vertical board mount, right angle board mount, and cable I/O configurations supporting 1X, 4X, and 8X 100 Ω and 85 Ω differential serial buses. Its balanced design limits skew within pairs. The MIL-DTL-83513 (Micro-D) qualified contact system and metal shells ensure ruggedness and durability for all high-speed/signal integrity applications.

The AirBorn stackable compliant connector family is one of AirBorn’s solutions for high-density, board-to-board stacking applications. This connector family is available in 0.075” contact spacing and 100 Ω and 85 Ω differential serial buses.

• Wide variety of standard pin/tail lengths accommodate any board-to-board spacing
• 0.075” contact spacing
• Reliable “eye of the needle”-compliant section design eliminates soldering
• BeCu contacts (special high-conductivity, high-temperature alloy)
• Very robust socket contact (low-stress design)
• Individually repairable contacts

The RZ family of high-density, board-to-board or flex circuit stacking applications is unique, offering users a reliable one-piece contact system.  Its solderless interconnect is compressed or “sandwiched” under pressure between parallel printed wiring boards or between a printed wiring board and other electronic components such as an IC or multi-chip module.